View Full Version : AMD: No future in Multicore
chaminga_d
12-17-2006, 06:02 PM
AMD believes that there is no future in general multicore processing and that the race to shoving more and more cpus onto 1 die is the MHz race all over again. They are planning to go a different route with APU's, or Accelarated Processing Units. Instead of just adding more and more general processing cpus AMD will add specialized cores that excel at a certain task. The Fusion project to integrate a GPU with the CPU is the first step towards that goal.
Full Article (http://techreport.com/onearticle.x/11438)
tckrockz
12-17-2006, 06:05 PM
ela ne
Anusha
12-17-2006, 06:20 PM
We have only one option: wait and see. :yes:
romainadrian
12-17-2006, 07:01 PM
thankz a lot. marry x-mas & happy new year
romainadrian
12-17-2006, 07:04 PM
thankz a lot. marry x-mas & happy new year
chaminga_d
12-17-2006, 07:10 PM
thankz a lot. marry x-mas & happy new year
::: KEEP POSTING :::
zCexVe
12-17-2006, 08:18 PM
Elakiri!Even now AMD has the memory controller on die.
zCexVe
12-17-2006, 08:20 PM
Guyz usually AMD athlon 64 heats up to 40 C,nVidia/ATI Gpu goes to 50-60 C.:rolleyes:
Combined 100C:shocked::shocked:
We need water cooling guys:rolleyes::rolleyes::rolleyes:
too we can make our own tea ,coffee if this comes out:lol::lol::lol:
AMD will need super conductors i think:rolleyes::rolleyes::rolleyes:
Anusha
12-17-2006, 08:49 PM
Guyz usually AMD athlon 64 heats up to 40 C,nVidia/ATI Gpu goes to 50-60 C.:rolleyes:
Combined 100C:shocked::shocked:
We need water cooling guys:rolleyes::rolleyes::rolleyes:
too we can make our own tea ,coffee if this comes out:lol::lol::lol:
AMD will need super conductors i think:rolleyes::rolleyes::rolleyes:
Are you nuts? You can't add those temperatures just like that. And water cooling isn't that great. It can only have about 5C advantage and even no advantage if the HSF is a state-of-the-art one from a reputed manufaturer + if you used arctic silver 5 thermal compound. The best thing with water cooling is that the system is totally idle.
Anusha
12-17-2006, 08:53 PM
Also this is not on the same process technology. A die shrink usually means lower dissipation at the same speed. Besides, there will always be power saving features.
zCexVe
12-17-2006, 09:23 PM
yes boss,Ure right.I was just saying that how hard it would be for amd to design new sockets,power management for both,heat + conductivity probs,researching time+ money etc,etc,etc...What is "arctic silver 5 thermal compound"?Is it differ than the normal thermal grease we use?how?
Anusha
12-17-2006, 09:37 PM
yes boss,Ure right.I was just saying that how hard it would be for amd to design new sockets,power management for both,heat + conductivity probs,researching time+ money etc,etc,etc...What is "arctic silver 5 thermal compound"?Is it differ than the normal thermal grease we use?how?
Arctic silver is the best thermal compound out there. now they are at version 5 (there wasn't a 4 though iirc) It actually has silver particles in it. Silver is the best conductor out there. What we use is better than nothing - that's all.
chaminga_d
12-17-2006, 09:40 PM
There are Different thermal compounds
ArcticSilver, AOS "HTC" Compound, standard silicone compound.....
Most standard thermal compound consists of silicone. However, silicone doesn't have a high thermal conductivity, so they also contains zinc oxide to improve this.
High-End thermal compounds are usually silicone-free, and use metal-based additives (e.g. aluminum oxide or nitride, or even pulverized silver!) instead of Zinc Oxide.
http://img244.imageshack.us/img244/9582/thermalcompoundgr2.jpg
prasadana2
12-17-2006, 09:46 PM
Ela ela..
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